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Semiconductor device and manufacturing method

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申请人台湾积体电路制造股份有限公司

发明人翁崇铭

公开号CN113156578B

授权号CN113156578B

申请日2021-01-04

公开日2023-06-20

授权日2023-06-20

摘要

The present disclosure relates to semiconductor devices and manufacturing methods. Photonic devices and fabrication methods are provided. In an embodiment, a filling material and/or auxiliary waveguides are utilized in order to protect other internal structures (eg, grating couplers) from the …

Semiconductor device and manufacturing method

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