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Resin composition, prepreg, metal foil laminate, and printed circuit board …

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申请人台燿科技股份有限公司
发明人刘淑芬
公开号CN113667232B
授权号CN113667232B
申请日2020-05-21
公开日2023-09-01
授权日2023-09-01

摘要

A resin composition, a prepreg, a metal foil laminate, and a printed circuit board produced using the resin composition. A kind of resin composition, it comprises: (A) has the compound of formula (I) structure, Wherein, R is an organic group; and (B) a vinyl-containing elastomer, wherein the …

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