树脂配方中国已授权
Resin composition, and prepreg, laminated board and printed circuit board …
摘要
The invention provides a resin composition, which comprises the following components in percentage by weight: a modified maleimide prepolymer; an epoxy resin; a curing agent; the modified maleimide prepolymer is prepared by at least pre-polymerizing a maleimide compound and an allyl compound; the …
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