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Polyamide moulding compositions and multilayer structures made therefrom

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申请人Ems专利股份公司

发明人藤井孝昌

公开号CN107974080B

授权号CN107974080B

申请日2017-10-20

公开日2021-07-20

授权日2021-07-20

摘要

The invention relates to polyamide molding compositions having excellent adhesion to metal surfaces. Furthermore, the invention relates to structural components having metal components directly bonded to thermoplastic components (interconnected without the use of an adhesive/bonding layer). The …

Polyamide moulding compositions and multilayer structures made therefrom

摘要

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