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Photo-thermal dual-curing resin composition and preparation method and …

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申请人韦尔通(厦门)科技股份有限公司
发明人刘涛
公开号CN113652186B
授权号CN113652186B
申请日2021-09-29
公开日2022-04-19
授权日2022-04-19

摘要

The invention belongs to the field of adhesives and sealants, and relates to a photothermal dual-curing resin composition and a preparation method and application thereof. The resin composition includes the following components in parts by weight: 20-40 parts of epoxy resin, 15-30 parts of …

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