树脂配方中国已授权
Light/heat dual-curing resin composition and preparation method and application …
摘要
The invention belongs to the field of adhesives and sealants, and relates to a light/heat dual-curing resin composition, and a preparation method and application thereof. The light/heat dual-curable resin composition contains epoxy resin, polythiol compound, acrylate compound, curing accelerator, …
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