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Fast cure epoxy resin compositions

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申请人Cytec Engineered Materials Ltd.

发明人Ian Aspin

公开号EP3919542B1

授权号EP3919542B1

申请日2016-06-02

公开日2023-03-15

授权日2023-03-15

摘要

A composition of liquid hardeners consisting of, in mass percentage, 25% isophorone diamine (IPDA) and 75% N-(3-aminopropyl)-imidazole (API). A composition of liquid hardeners consisting of, in mass percentage, 50% isophorone diamine (IPDA) and 50% N-(3-aminopropyl)-imidazole (API). A composition …

Fast cure epoxy resin compositions

摘要

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