工艺装备日本已授权
Epoxy resin composition using solvated solid
摘要
A curing component, a first curing agent 8wt% ~ 5 0wt% of the composition, A curing component comprising 0.001 wt% to 5 wt% of a second curing agent of the composition; Career, 30 wt% to 85 wt% epoxy component of the composition; An epoxy resin composition comprising: The second curing agent is …
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