工艺装备日本已授权

Curable resin composition, and film, molded article, prepreg and fiber …

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申请人三菱ケミカル株式会社

发明人久也牛山

公开号JP6620877B2

授权号JP6620877B2

申请日2017-12-21

公开日2019-12-18

授权日2019-12-18

摘要

Curable resin composition comprising the following components (A), (B), (C) , (D) and (H) : Component (A): bisphenol type epoxy resin having a softening point of 80 ° C. or higher, Component (B): bisphenol-type epoxy resin that is liquid at 25 ° C. Component (C): Bifunctional or higher functional …

Curable resin composition, and film, molded article, prepreg and fiber &hellip;

摘要

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Curable resin composition, and film, molded article, prepreg and fiber …