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Curable resin composition, and film, molded article, prepreg, and fiber- …

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申请人日商三菱化學股份有限公司

发明人牛山久也

公开号TWI655239B

授权号TWI655239B

申请日2017-12-20

公开日2019-04-01

授权日2019-04-01

摘要

A curable resin composition comprising the following components (A), (B), (C), and (D) Component (A): a bisphenol-type epoxy resin component having a softening temperature of 80 ° C or higher ( B): Bisphenol-type epoxy resin component (C) in liquid state at 25 ° C: (meth) acrylate compound-based …

Curable resin composition, and film, molded article, prepreg, and fiber- &hellip;

摘要

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Curable resin composition, and film, molded article, prepreg, and fiber- …