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Apparatus, system and molding method for resin transfer molding

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申请人中材科技风电叶片股份有限公司

发明人牛娟娟

公开号CN115583051B

授权号CN115583051B

申请日2022-09-26

公开日2024-05-10

授权日2024-05-10

摘要

15 . The device for resin transfer molding according to claim 1 , wherein the flow-conducting and air-conducting medium layer is a low-weight flow-conducting net or a low-adhesive-absorbing flow-conducting cotton. 16. The device for resin transfer molding according to any one of claims 1 to 8 and 9 …

Apparatus, system and molding method for resin transfer molding

摘要

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