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A kind of epoxy resin composition and preparation method thereof

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申请人上海道宜半导体材料有限公司
发明人詹友为
公开号CN115466486B
授权号CN115466486B
申请日2022-07-05
公开日2023-07-28
授权日2023-07-28

摘要

The invention relates to the field of C08L63/00, in particular to an epoxy resin composition and a preparation method thereof, wherein the epoxy resin composition is provided by adopting 4-14 parts of epoxy resin, 2-9 parts of curing agent, 78-92 parts of inorganic filler, 0.05-1 part of catalyst …

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