工艺与制造英文2020被引 39
环氧树脂/聚醚醚酮基复合材料的超声波焊接：能量导向器材料和耦合层厚度的研究
Ultrasonic welding of epoxy- to polyetheretherketone- based composites: Investigation on the material of the energy director and the thickness of the coupling layer
Eirini Tsiangou, Sofia Teixeira de Freitas, Irene Fernández Villegas, Rinze Benedictus · Delft University of Technology
摘要整理
超声波焊接是连接热塑性复合材料与热固性复合材料的高效技术。通过在待焊接表面共固化热塑性耦合层，使热固性复合材料具有可焊性。选择相容的热塑性和热固性材料组合可获得可靠的焊接接头。将碳纤维/聚醚醚酮（PEEK）复合材料焊接到热固性复合材料时，由于PEEK薄膜与环氧树脂不相容，不适合作为耦合层。相比之下，聚醚亚胺是理想选择，因其在高温下与大多数环氧体系和PEEK聚合物相容。本研究重点关注两个方面：首先，能量导向器（用于促进界面热生成的平面热塑性薄膜）的材料性质。能量导向器可采用聚醚亚胺（与耦合层相同）或PEEK材料（与热塑性复合材料基体相同）。研究表明两种材料均能产生机械性能相似的焊接接头。其次，研究了耦合层厚度的影响。由于PEEK基体熔融温度较高，60 μm厚的耦合层作为环氧树脂热屏障的效果不足，加热时间不足以产生完全焊接的接头。通过将耦合层厚度增加至250 μm可解决此问题，从而获得高强度焊接接头。
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