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工艺与制造英文1997被引 35

Rheological characteristics and cure kinetics of EPON 862/W epoxy used in pultrusion

R. Shanku, J. G. Vaughan, J. A. Roux · University of Mississippi
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期刊 / 来源Advances in Polymer Technology
卷/期/页16 / 4 / 297-311
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摘要整理

Differential scanning calorimetry (DSC) was used to measure the kinetic parameters of the EPON 862/W epoxy system (Shell EPON® Resin DPL-862/EPON CURING AGENT® W/EPON CURING AGENT® Accelerator 537). Heat of reaction, degree of cure, pre-exponential constant, and activation energy were determined using dynamic scanning at heating rates of 5, 10, and 20°C/min. Using a Brookfield DV-III rotational-type rheometer, the viscosity was measured isothermally as a function of time at temperatures of 23°, 35°, 45°, 55°, 65°, 80°, 90°, and 100°C. Experimental modeling of the rheological characteristics of the resin was conducted using expressions correlating the viscosity and the degree of cure. Viscosities calculated by the model were in good agreement with data obtained experimentally. © 1997 John Wiley & Sons, Inc. Adv Polymer Techn 16: 297–311, 1997

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