Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power Systems
摘要整理
The purpose of this technical presentation is to investigate thermal management solutions used to solve thermal performance limitations of power modules and high-power processors, such as GPUs for autonomous driving. With the rise in computing and power electronics in automobiles, the need for heat dissipation increases. The challenges include decreasing package sizes, creating fan-less system requirements, and higher ambient operating temperatures. Existing thermal interface material (TIM) range from gap pads, thermal grease, liquid-dispensed TIM, and phase-change material. Dexerials will introduce a gap pad TIM with carbon fiber for automotive applications and propose novel thermal management setups to reduce thermal resistance, keep system cooling requirements to a minimum, and maintain optimal system performance over lifetime of the product.